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Senior Scientist, QPU Integration and TSV Technologies
Location
espoo
Published
3 days ago · 14 Sep 2026
Description
Senior Scientist, QPU Integration and TSV Technologies Company: VTT Location: espoo Posted: 2026-09-14 Lead development and optimization of superconducting TSV processes on 200 mm wafers. Own the technical roadmap for TSV and QPU integration, driving process transfer and scaling. Requires a PhD and 6+ years of cleanroom experience.
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